Flash memory array system including a top gate memory cell

ABSTRACT

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a division off of application Ser. No. 12/507,783, filed Jul.22, 2009, published as US2009/0323415A1, now U.S. Pat. No. 7,848,140,which is a division of application Ser. No. 11/235,901, filed Sep. 26,2005, published as US2007/0070703A1, now U.S. Pat. No. 7,567,458, all ofwhich are incorporated herein by reference in entirety.

BACKGROUND

1. Field

The present invention relates to a flash memory array system, and moreparticularly to a flash memory array system with multilevel memory cellshaving a top gate.

2. Description of Related Information

A conventional mixed mode integrated circuit system frequently usesdifferent voltage supplies. Analog signal processing, such asamplification, comparison, impulsive generation, may be performed athigh voltage. A flash memory applies an erase signal, a programmingsignal and a read signal to flash memory cells. The erase signal,programming signal, and read signal have voltage levels greater than asupply voltage. Also in multilevel volatile memories, the variation ofthe voltage level of the signal falls in a smaller range for themulti-bits signals stored in the memory cells. A charge pump and avoltage regulator may be used to generate the erase signal, theprogramming signal, and the read signal. Flash memory cells have aselect gate, a top gate and a floating gate for charge storage inresponse to the erase signal, the programming signal and the readsignal.

SUMMARY

A memory system comprises a plurality of memory cells arranged insectors. Each memory cell has a top gate. The memory system furthercomprises a control circuit coupled to the plurality of memory cells tocontrol the disabling of top gates of memory cells that are defective.The memory cells may be multilevel memory cells.

In another aspect, a memory system comprises a plurality of memory cellsarranged in sectors. Top gates of memory cells in a sector are coupledto a first line; source lines of memory cells in the sector are coupledto a second line.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a source side injection flash memorycell with a top gate.

FIG. 2 is a schematic symbol of a cell structure of a four terminalsource side injection flash cell of FIG. 1.

FIG. 3 is a block diagram illustrating a memory system.

FIG. 4 is a schematic diagram illustrating a first embodiment of anarray architecture of the memory system of FIG. 3.

FIG. 5 is a schematic diagram illustrating a second embodiment of anarray architecture of the memory system of FIG. 3.

FIG. 6 is a schematic diagram illustrating a third embodiment of anarray architecture of the memory system of FIG. 3.

FIG. 7 is a table illustrating operating voltages for array operation.

FIG. 8 is a top plan view illustrating the metallization for an arraysector.

FIG. 9 is a block diagram illustrating a portion of the memory system ofFIG. 3.

FIG. 10 is a timing diagram illustrating the operation of the top gatecontrol timing of the memory system of FIG. 9.

FIG. 11 is a block diagram illustrating a top gate control circuit ofthe memory system of FIG. 9.

FIG. 12 is a schematic diagram illustrating a first embodiment of a lowvoltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 13 is a schematic diagram illustrating a first embodiment of a highvoltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 14 is a schematic diagram illustrating a second embodiment of a lowvoltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 15 is a schematic diagram illustrating a second embodiment of ahigh voltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 16 is a schematic diagram illustrating a third embodiment of a lowvoltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 17 is a schematic diagram illustrating a third embodiment of a highvoltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 18 is a schematic diagram illustrating a fourth embodiment of ahigh voltage decoder circuit of the top gate control circuit of FIG. 11.

FIG. 19A is a flowchart illustrating the operation of the top gatehandling logic circuit of FIG. 9.

FIG. 19B is a waveform illustrating the operation of the top gatehandling logic circuit of FIG. 9.

FIG. 20 is a schematic diagram illustrating the dynamic top gatecoupling during a read according to a first embodiment.

FIG. 21 is a schematic diagram illustrating the dynamic top gatecoupling during a read according to a second embodiment.

DETAILED DESCRIPTION OF EXEMPLARY IMPLEMENTATIONS

A method and apparatus for a four terminal source side injection flashmemory system including a top gate, and more particularly a fourterminal source side injection flash memory cell with top gate operationis described.

The system includes a bad top gate latch for disabling by either serialloading, parallel loading or shared decoding loading. The system alsoincludes dynamic top gate coupling operation. Various top gate arrayarchitectures are described with performance tradeoffs.

FIG. 1 is a cross-sectional view of a source side injection flash memorycell with a top gate. FIG. 2 is a diagram illustrating a transistorsymbol corresponding to the four terminal source side injection flashcell of FIG. 1.

To facilitate the understanding of the invention, a brief description ofa memory cell technology is described below. In an embodiment theinvention applies to Source Side Injection (SSI) flash memory celltechnology, which will be referred to as SSI flash memory celltechnology. The invention is equally applicable to other technologiessuch as drain-side channel hot electron (CHE) programming (ETOX),P-channel hot electron programming, other hot electron programmingschemes, Fowler-Nordheim (FN) tunneling, ferro-electric memory, andother types of memory technology.

This cell may be formed of three polysilicon gates (abbreviated aspoly), a floating gate poly FG 201, a top coupling gate poly TG 202, anda select gate (also known as word line, which is used interchangeablyherein) poly SG 203. The select gate SG 203 may also act as a selectgate that individually selects each memory cell. This has the advantageof avoiding the over erase problem which is typical of stacked gate CHEflash cell. The floating gate 201 has a poly tip structure that pointsto the word line 203 to enhance the electric field from the floatinggate 201 to the word line 203, which allows a much lower voltage in FNerase without using a thin interpoly oxide. The top gate 202 acts tocouple voltage to the FG 201 during programming, erase and readoperations. The top gate 202 may also act to select or deselect eachmemory cell.

The thicker interpoly oxide leads to a higher reliability memory cell.The top gate TG 202 may provide a very high coupling ratio from TG 202into the FG 201, which is advantageous to SSI programming and allows alow erase voltage, which is described below. A structural gap betweenthe FG 201 and SG 203 is also advantageous for the efficient SSIprogramming. The cell may also be fabricated such that a major portionof the FG 201 overlaps the source junction 205. This may also make avery high coupling ratio from the source gate for the floating gate 201,which allows a lower erase voltage and is advantageous to the SSIprogramming.

The SSI flash memory cell enables low voltage and low power performancedue to its intrinsic device physics resulting from its device structure.The SSI flash cell uses efficient FN tunneling for erase and efficientSSI for programming. The SSI flash cell programming requires a smallcurrent in hundreds of nano amps and a moderate voltage range of about 8to 11 volts. This is in contrast to that of a typical drain-side channelhot electron memory cell programming which requires current in hundredsof microamp to milliamp range and a voltage in the range of 11 to 13volts.

The SSI flash memory cell erases by utilizing Fowler-Nordheim tunnelingfrom the floating gate poly to the select gate poly by applying a higherase voltage on the word line 203, e.g., 5-13 volts, and a low voltageon the source 205, e.g., 0-1.5 volts, and a low or negative voltage onthe top gate 202, e.g., 0V or −5 to −12V. The high erase voltagetogether with high coupling from the top gate and source to the floatinggate 201 creates a localized high electric field from the tip of thefloating gate 201 to the word line 203 and causes electrons to tunnelfrom the floating gate 201 to the word line 203 near the tip region. Theresulting effect causes a net positive charge on the floating gate 201.An alternative erase may be done by applying a high voltage on the wordline 203 and a negative voltage on the channel and/or the top gate 202.Another alternative erase may be done from the floating gate 201 to thetop gate 202 by applying a low or negative voltage on the word line 203and/or source drain and a positive high voltage on the top gate 202. Inthis case, an erase may be done by the tip from the floating gate 201 tothe top gate 202 at the wrap around on the right side of FIG. 1.

The SSI flash memory cell programs by applying a medium high voltage ona source 205 (herein also known as common line CL), e.g., 3.5-6 V, a lowvoltage on the word line 203, e.g., 0.7-2.5 V, a high voltage on the topgate TG 202, e.g., 8-13 V, and a low voltage on the drain 206 (hereinalso known as the bitline BL), e.g., 0-1V or a current bias on the drain206, e.g., 0.050-10 microamps. The high voltage on the top gate 202 anda medium high voltage on the source 205 are strongly coupled to the FGto strongly turn on the channel under the floating gate (it will beequivalently referred to as the FG channel). This in turn couples themedium high voltage on the source 205 toward the gap region. The voltageon the word line 203 turns on the channel directly under the word line203 (it will be equivalently referred to as the SG channel). This inturn couples the voltage on the drain 206 toward the gap region. Hencethe electrons flow from the drain junction 206 through the SG channel,through the gap channel, through the FG channel, and finally arrive atthe source junction.

Due to the gap structure between the word line 203 and the floating gate201, in the channel under the gap, there exists a strong lateralelectric field EGAPLAT 210. As the EGAPLAT 210 reaches a critical field,electrons flowing across the gap channel become hot electrons. A portionof these hot electrons gains enough energy to cross the interfacebetween the silicon and silicon dioxide into the silicon dioxide. And asthe vertical field Ev is very favorable for electrons to move from thechannel to the floating gate 201, many or most of these hot electronsare swept toward the floating gate 201, thus, reducing the voltage onthe floating gate 201. The reduced voltage on floating gate 201 reduceselectrons flowing into the floating gate 201 as programming proceeds.

Due to the coincidence of favorable Ev and high EGAPLAT 210 in the gapregion, the SSI memory cell programming is more efficient over that ofthe drain-side CHE programming, which only favors one field over theother. Programming efficiency is measured by how many electrons flowinto the floating gate as a portion of the current flowing in thechannel. High programming efficiency allows reduced power consumptionand parallel programming of multiple cells in a page mode operation.

The memory cell may be fabricated using, for example, a method similarto that described in U.S. Pat. No. 6,593,177 by Dana Lee assigned to thesame assignee as this patent application, the subject matter of which isincorporated herein by reference.

FIG. 3 is a block diagram illustrating a digital multilevel bit memoryarray system 100. For clarity, some signal lines of the memory arraysystem 100 are not shown in FIG. 1.

In one embodiment, the memory array includes a source side injectionflash technology, which uses lower power in hot electron programming,and efficient injector based Fowler-Nordheim tunneling erasure. Theprogramming may be done by applying a medium high voltage on the sourceof the memory cell, a high voltage on the top coupling gate of thememory cell, a bias voltage on the select gate of the memory cell, and abias current on the drain of the memory cell. The programming in effectplaces electrons on the floating gate of memory cell. The erase is doneby applying a high voltage on the select gate of the memory cell, a lowor negative voltage on the top coupling gate, and a low or negativevoltage on the source and/or drain of the memory cell. The erase ineffect removes electrons from the floating gate of memory cell. Theverify (sensing or reading) is done by placing the memory cell in avoltage mode sensing, e.g., a bias voltage on the source, a bias voltageon the select gate, a bias voltage or ground on the top coupling gate, abias current coupled from the drain (bitline) to a low bias voltage suchas ground, and the voltage on the drain is the readout cell voltageVCELL. The bias current may be independent of the data stored in thememory cell. In another embodiment, the verify (sensing or reading) isdone by placing the memory cell in a current mode sensing, e.g., a lowvoltage on the source, a bias voltage on the select gate, a bias voltageor ground on the top coupling gate, a load (resistor or transistor)coupled to the drain (bitline) from a high voltage supply, and thevoltage on the load is the readout voltage. In one embodiment, the arrayarchitecture and operating methods may be similar (with the addition oftop coupling gate) the ones disclosed in U.S. Pat. No. 6,282,145,entitled “Array Architecture and Operating Methods for DigitalMultilevel Nonvolatile Memory Integrated Circuit System” by Tran et al.,the subject matter of which is incorporated herein by reference.

The digital multilevel bit memory array system 100 includes a pluralityof regular memory arrays 101, a plurality of redundant memory arrays(MFLASHRED) 102, a spare array (MFLASHSPARE) 104, and a reference array(MFLASHREF) 106. An N-bit digital multilevel cell is defined as a memorycell capable of storing 2^(N) levels.

In one embodiment, the memory array system 100 stores one gigabits ofdigital data with 4-bit multilevel cells, and the regular memory arrays101 are equivalently organized as 8,192 columns and 32,768 rows.Addresses A<12:26> are used to select a row, and addresses A<0:11> areused to select two columns for one byte. A page is defined as a group of512 bytes corresponding to 1,024 columns or cells on a selected row. Apage is selected by the A<9:11> address. A row is defined here asincluding 8 pages. A byte within a selected page is selected by theaddress A<0:8>. Further, for each page of 512 regular data bytes, thereare 16 spare bytes that are selected by the address A<0:3>, which areenabled by other control signals to access the spare array and not theregular array as is normally the case. Other organizations are possiblesuch as a page including 1024 bytes or a row including 16 or 32 pages.

The reference array (MFLASHREF) 106 is used for a reference system ofreference voltage levels to verify the contents of the regular memoryarray 101. In another embodiment, the regular memory arrays 101 mayinclude reference memory cells for storing the reference voltage levels.

The redundancy array (MFLASHRED) 102 is used to increase productionyield by replacing bad portions of the regular memory array 101.

The spare array (MFLASHSPARE) 104 may be used for extra data overheadstorage such as for error correction and/or memory management (e.g.,status of a selected block of memory being erased or programmed, numberof erase and program cycles used by a selected block, or number of badbits in a selected block). In another embodiment, the digital multilevelbit memory array system 100 does not include the spare array 104.

The digital multilevel bit memory array system 100 further includes aplurality of y-driver circuits 110, a plurality of redundant y-drivercircuits (RYDRV) 112, a spare y-driver circuit (SYDRV) 114, and areference y-driver (REFYDRV) circuit 116.

The y-driver circuit (YDRV) 110 controls bit lines (also known ascolumns, not shown in FIG. 1) during write, read, and erase operations.Each y-driver (YDRV) 110 controls one bitline at a time. Timemultiplexing may be used so that each y-driver 110 controls multiple bitlines during each write, read, and erase operation. The y-drivercircuits (YDRV) 110 are used for parallel multilevel page writing andreading to speed up the data rate during write to and read from theregular memory array 101. In one embodiment, for a 512-byte page with4-bit multilevel cells, there are a total of 1024 y-drivers 110 or atotal of 512 y-drivers 300.

The reference y-driver circuit (REFYDRV) 116 is used for the referencearray (MFLASHREF) 106. In one embodiment, for a 4-bit multilevel cell,there are a total of 15 or 16 reference y-drivers 116. The function ofthe reference y-driver 116 may be similar to that of the y-drivercircuit 110.

The redundant y-driver circuit (RYDRV) 112 is used for the redundantarray (MFLASHRED) 102. The function of redundant y-driver circuit(RYDRV) 112 may be similar to that of the y-driver circuit (YRDRV) 110.

The spare y-driver circuit (SYDRV) 114 includes a plurality of singlespare y-drivers (SYDRV) 114 used for the spare array (MFLASHSPARE) 104.The function of the spare y-driver circuit (SYDRV) 114 may be similar tothe function of the y-driver circuit (YDRV) 110. In one embodiment, fora 512-byte page with 4-bit multilevel cells with 16 spare bytes, thereare a total of 32 spare y-drivers 114.

The digital multilevel bit memory array system 100 further includes aplurality of page select (PSEL) circuits 120, a redundant page selectcircuit 122, a spare page select circuit 124, a reference page selectcircuit 126, a plurality of block decoders (BLKDEC) 130, a multilevelmemory precision spare decoder (MLMSDEC) 134, a byte select circuit(BYTESEL) 140, a redundant byte select circuit 142, a spare byte selectcircuit 144, a reference byte select circuit 146, a page address decoder(PGDEC) 150, a byte address decoder (BYTEDEC) 152, an addresspre-decoding circuit (X PREDEC) 154, an address pre-decoding circuit(XCGCLPRE1) 156, an input interface logic (INPUTLOGIC) 160, and anaddress counter (ADDRCTR) 162.

The page select circuit (PSEL) 120 selects one bit line (not shown) outof multiple bitlines for each single y-driver (YDRV) 110. In oneembodiment, the number of multiple bitlines connected to a singley-driver (YDRV) 110 is equal to the number of pages. The correspondingselect circuits for the reference array 106, the redundant memory array102, and the spare memory array 104 are the reference page selectcircuit 126, the redundant page select circuit 122, and the spare pageselect circuit 124, respectively.

The byte select circuit (BYTESEL) 140 enables one byte data in or onebyte data out of a pair of the y-driver circuits (YDRV) 110 at a time.The corresponding byte select circuits for the reference array 106, theredundant memory array 102, and the spare memory array 104 are thereference byte select circuit 146, the redundant byte select circuit142, and the spare byte select circuit 144, respectively.

The block decoder (BLKDEC) 130 selects a row or a block of rows in thearrays 101 and 102 based on the signals from the address counter 162(described below) and provides precise multilevel bias values overtemperature, process, and power supply used for consistent single levelor multilevel memory operation for the regular memory array 101 and theredundant memory array 102. The multilevel memory precision sparedecoder (MLMSDEC) 134 selects a spare row or block of spare rows in thespare array 104 and provides precise multilevel bias values overtemperature, process corners, and power supply used for consistentmultilevel memory operation for the spare array 104. The intersection ofa row and column selects a cell in the memory array. The intersection ofa row and two columns selects a byte in the memory array.

The address pre-decoding circuit 154 decodes addresses. In oneembodiment, the addresses are A<16:26> to select a block of memory arraywith one block comprising 16 rows. The outputs of the addresspre-decoding circuit 154 are coupled to the block decoder 130 and thespare decoder 134. The address pre-decoding circuit 156 decodesaddresses. In one embodiment, the addresses are addresses A<12:15> toselect one row out of sixteen within a selected block. The outputs ofaddress pre-decoding circuit 156 are coupled to the block decoder 130and the spare decoder 134.

The page address decoder 150 decodes page addresses, such as A<9:11>, toselect a page, e.g., P<0:7>, and provides its outputs to the page selectcircuits 120, 122, 124, and 126. The byte address decoder 152 decodesbyte addresses, such as A<0:8>, and provides its outputs to the byteselect circuit 140 to select a byte. The byte predecoder 152 alsodecodes spare byte address, such as A<0:3> and AEXT (extension address),and provides its outputs to the spare byte select circuit 144 to selecta spare byte. A spare byte address control signal AEXT is used togetherwith A<0:3> to decode addresses for the spare array 104 instead of theregular array 101.

The address counter (ADDRCTR) 162 provides addresses A<II:AN>, A<9:10>,and A<0:8> for row, page, and byte addresses, respectively. The outputsof the address counter (ADDRCTR) 162 are coupled to circuits 154, 156,150, and 152. The inputs of the address counter (ADDRCTR) 162 arecoupled from the outputs of the input interface logic (INPUTLOGIC) 160.

The input interface logic circuit (INPUTLOGIC) 160 provides an externalinterface to external systems, such as an external systemmicrocontroller. Typical external interface for memory operations areread, write, erase, status read, identification (ID) read, ready busystatus, reset, and other general purpose tasks. A serial interface canbe used for the input interface to reduce pin counts for a high-densitychip due to a large number of addresses. Control signals (not shown)couple the input interface logic circuit (INPUTLOGIC) 160 to theexternal system microcontroller. The input interface logic circuit(INPUTLOGIC) 160 includes a status register that indicates the status ofthe memory chip operation such as pass or fail in program or erase,ready or busy, write protected or unprotected, cell margin good or bad,restore or no restore, and the like.

The digital multilevel bit memory array system 100 further includes analgorithm controller (ALGOCNTRL) 164, a band gap voltage generator(BGAP) 170, a voltage and current bias generator (V&IREF) 172, aprecision oscillator (OSC) 174, a voltage algorithm controller (VALGGEN)176, a test logic circuit (TESTLOGIC) 180, a fuse circuit (FUSECKT) 182,a reference control circuit (REFCNTRL) 184, a redundancy controller(REDCNTRL) 186, voltage supply and regulator (VMULCKTS) 190, a voltagemultiplexing regulator (VMULREG) 192, input/output (10) buffers 194, andan input buffer 196.

The algorithm controller (ALGOCNTRL) 164 is used to handshake the inputcommands from the input logic circuit (INPUTLOGIC) 160 and to executethe multilevel erase, programming and sensing algorithms used formultilevel nonvolatile operation. The algorithm controller (ALGOCNTRL)164 is also used to algorithmically control the precise bias and timingconditions used for multilevel precision programming.

The test logic circuit (TESTLOGIC) 180 tests various electrical featuresof the digital circuits, analog circuits, memory circuits, high voltagecircuits, and memory array. The inputs of the test logic circuit(TESTLOGIC) 180 are coupled from the outputs of the input interfacelogic circuit (INPUTLOGIC) 160. The test logic circuit (TESTLOGIC) 180also provides timing speed-up in production testing such as in fasterwrite/read and mass modes. The test logic circuit (TESTLOGIC) 180 alsoprovides screening tests associated with memory technology such asvarious disturb and reliability tests. The test logic circuit(TESTLOGIC) 180 also allows an off-chip memory tester to directly takeover the control of various on-chip logic and circuit bias circuits toprovide various external voltages and currents and external timing. Thisfeature permits, for example, screening with external voltage andexternal timing or permits accelerated production testing with fastexternal timing.

The fuse circuit (FUSECKT) 182 is a set of nonvolatile memory cellsconfigured at the external system hierarchy, at the tester, at the user,or on chip on-the-fly to achieve various settings. These settings caninclude precision bias values, precision on-chip oscillator frequency,programmable logic features such as write-lockout feature for portionsof an array, redundancy fuses, multilevel erase, program and readalgorithm parameters, or chip performance parameters such as write orread speed and accuracy.

The reference control circuit (REFCNTRL) 184 is used to provideprecision reference levels for precision voltage values used formultilevel programming and sensing. The redundancy controller (REDCNTRL)186 provides redundancy control logic.

The voltage algorithm controller (VALGGEN) 176 provides variousspecifically shaped voltage signals of amplitude and duration used formultilevel nonvolatile operation and to provide precise voltage valueswith tight tolerance, used for precision multilevel programming,erasing, and sensing. The bandgap voltage generator (BGAP) 170 providesa precise voltage value over process, temperature, and supply formultilevel programming and sensing.

The voltage and current bias generator (V&IREF) 172 is a programmablebias generator. The bias values are programmable by the settings ofcontrol signals from the fuse circuit (FUSECKT) 182 and also by variousmetal options. The oscillator (OSC) 174 is used to provide accuratetiming for multilevel programming and sensing.

The input buffer 196 provides buffers for input/output with the memoryarray system 100. The input buffer 196 buffers an input/output line 197coupled to an external circuit or system, and an input/output bus 194B,which couples to the arrays 101, 102, 104, and 106 through the y-drivers110, 112, 114, and 116, respectively. In one embodiment, the inputbuffer 196 includes TTL input buffers or CMOS input buffers. In oneembodiment, the input buffer 196 includes an output buffer with slewrate control or an output buffer with value feedback control.Input/output (IO) buffer blocks 194 includes typical input buffers andtypical output buffers. A typical output buffer is, for example, anoutput buffer with slew rate control, or an output buffer with levelfeedback control. A circuit block 196R is an open drained output bufferand is used for ready busy handshake signal (R/RB) 196RB.

The voltage supply and regulator (VMULCKT) 190 provides regulatedvoltage values above or below the external power supply used for erase,program, read, and production tests. In one embodiment, the voltagesupply and regulator 190 includes a charge pump or a voltage multiplier.The voltage multiplying regulator (VMULREG) 192 provides regulation forthe regulator 190 for power efficiency and for transistor reliabilitysuch as to avoid various breakdown mechanisms.

The system 100 may execute various operations on the memories 101, 102,104, and 106. An erase operation may be done to erase all selectedmultilevel cells by removing the charge on selected memory cellsaccording to the operating requirements of the non-volatile memorytechnology used. A data load operation may be used to load in aplurality of bytes of data to be programmed into the memory cells, e.g.,0 to 512 bytes in a page. A read operation may be done to read out inparallel a plurality of bytes of data if the data (digital bits), e.g.,512 bytes within a page, stored in the multilevel cells. A programoperation may be done to store in parallel a plurality of bytes of datain (digital bits) into the multilevel cells by placing an appropriatecharge on selected multilevel cells depending on the operatingrequirements of the non-volatile memory technology used. The operationson the memory may be, for example, similar to (with the addition of thetop gate) the operations described in U.S. Pat. No. 6,282,145,incorporated herein by reference above.

Control signals (CONTROL SIGNALS) 196L, input/output bus (IO BUS) 194L,and ready busy signal (R/BB) 196RB are for communication with the system100.

A flash power management circuit (FPMU) 198 manages power on-chip suchas powering up only the circuit blocks in use. The flash powermanagement circuit 198 also provides isolation between sensitive circuitblocks from the less sensitive circuit blocks by using differentregulators for digital power (VDDD)/(VSSD), analog power (VDDA) (VSSA),and IO buffer power (VDDIO)/(VSSIO). The flash power management circuit198 also provides better process reliability by stepping down powersupply VDD to lower levels required by transistor oxide thickness. Theflash power management circuit 198 allows the regulation to be optimizedfor each circuit type. For example, an open loop regulation could beused for digital power since highly accurate regulation is not required;and a closed loop regulation could be used for analog power since analogprecision is normally required. The flash power management also enablescreation of a “green” memory system since power is efficiently managed.

FIG. 4 is a schematic diagram of a first embodiment of an arrayarchitecture. A segment of memory cells is shown in FIG. 4. In thisembodiment, the source lines SL0 through SL7 are coupled to a commonline 401. Thus, the source lines of this segment are coupled to eachother. The top gate lines TG0 through TG7 are coupled to a common line402. Thus, the top gate lines of a segment are coupled to each other. Inthis embodiment, the metallization includes eight lines for the wordline, one line for the top gate terminals and one source line for atotal of 10 metal lines. In this array architecture, the metallizationorganization is simpler than those of FIGS. 5 and 6. Also, the decodingcircuitry may be simplified for the source line and the top gate becausethey are shared for the same segment. However, the programmingdisturbance may be worse due to when selected cells within a row areselected for programming, the unselected cells on other unselected rowsare disturbed from the source line seeing the applied source lineprogramming voltage and the top gate seeing the applied top gateprogramming voltage. In this array architecture, the loading on the topgate line 402 is heavy from driving all of (e.g., 8) top gates withinthe segment.

FIG. 5 is a schematic diagram of a second embodiment of an arrayarchitecture. A segment of memory cells is shown in FIG. 5. In thisembodiment, the source lines SL0 through SL7 are coupled to a commonline 501. Thus, the source lines of this segment are coupled to eachother. Unlike the array of FIG. 4, the top gate lines TG0 through TG7are not coupled to each other. In this embodiment, the metallizationincludes eight lines for the word line, eight lines for the top gateterminals and one source line for a total of 17 metal lines. Heremetallization organization is more complicated. However due toindividual selection of the top gate lines, disturb is better than thatof FIG. 4. due to unselected cells in unselected rows do not see appliedtop gate programming voltage for the selected cells. In thisarchitecture, individual top gate lines only see individual loading, andnot all top gate loading within the segment. Further, an individual topgate instead of a word line may be used to select or deselect the memorycells in read or programming; in this instance, all word lines may befurther connected together for the same segment, then an individual topgate is used to select or deselect the row in program or read.

FIG. 6 is a schematic diagram of a third embodiment of an arrayarchitecture. A segment of memory cells is shown in FIG. 6. In thisembodiment, some of the source lines SL0 through SL7 are coupled to acommon line 601 and others are coupled to a common line 611. Some of thetop gate lines TG0 through TG7 are coupled to a common line 602 andother of the top gate lines are coupled to a common line 612. In thisembodiment, the source lines for odd memory cells are tied together andthe source lines for even memory cells are tied together. The top gatesof odd memory cells are tied together and the top gate of even memorycells are tied together. In this embodiment, the metallization includeseight word lines, four top gate lines and two source lines for a totalof 14 metal lines. In this architecture, the disturbance is reduced byseparating the top gates into two halves and the source lines into twohalves interleaved into two top gate halves. When one half is selected,the other half is deselected. The loading for top gates is separatedinto two. Other alternative odd/even or more numbers of grouparrangement may be made.

The embodiment of FIG. 5 may have the least disturbance betweenswitching of memory cells, the embodiment of FIG. 4 may have the worstdisturbance but has less metal, and the embodiment of FIG. 6 may haveless disturbance but more metal.

FIG. 7 is a table illustrating operating voltages for array operation ofthe array of FIG. 3. The table of FIG. 7 shows the operating voltagesfor selected and unselected segments of the array during erase,programming, and read operations. In an illustrative example of anerase, word lines WL0, 2-7, a source line SL0, and bitlines BL0 throughBL7 are set equal to 0 volts for the selected segment. For theunselected segments, the word lines WL8-N, the source lines SL1-N andthe bitlines BLx-N are set equal to 0. The erase voltage VER for a wordline WL1 may be set equal to 11.5 volts and the top gate erase voltageVTGE of the top gate TG0 may be set equal to 0. In another example, theerase voltage VER is set equal to 5 volts and the top gate erase voltageis set equal to −10 volts. The top gate voltage VTGUNSEL of unselectedsegments is set to the supplied voltage VDD, ground, or negative. In anillustrative example of a program operation, the word line programmingvoltage VWLP of the word line WL1 is set approximately to 1.5 volts, thetop gate program voltage VTGP of the top gate TG0 is set toapproximately 10 volts, the source line programming voltage VSLP of thesource line SL0 of the selected segment is set to approximately 5 volts,and the bitline inhibit voltage VBLINH of the other bitlines is set tothe supply voltage VDD. In an illustrative example for read operation,the word line read voltage VWLRD of the word line WL1 is set to thesupply voltage VDD, the top gate read voltage VTGRD of the top gate TG0is set to the supply voltage VDD.

The array operation may be done without real time read switching for thetop gate. All the gates may be in a standby mode with a voltage VTGRDthat is approximately the supply voltage in a standby mode, oralternatively ground. As described below, the system provides a methodfor handling defective top gates. In one such embodiment, the standbycurrent, or a leakage current, may be used to detect defective topgates. The system also provides handling of capacitive coupling betweentop gates and word lines.

FIG. 8 is a top plan view illustrating the metallization for an arraysector.

In an illustrative example, the top gate lines TG0 and TG1 are disposedas parallel metallization lines. The metallization of the source lineSL0 and a plurality of word lines WL7 through WL0 are disposed on oneside of and parallel to the top gate line TG0. In a similar manner, asource line SL1 and a plurality of word lines WL8 through WL15 aredisposed on another side of and parallel to the top gate line TG1.Alternatively other arrangements, e.g., TG0,WL0-3, SL0,WL4-7,TG1,WL8-11,SL1, and WL-12-15, are possible.

FIG. 9 is a block diagram illustrating a portion of the memory system ofFIG. 3. An x-decoder 901 decodes addresses 902 or fuse addresses 903 andselects corresponding memory cells in the memory array 904. A top gatehandling logic circuit 905 controls switches 906 and 907 for couplingthe addresses 902 and fuse addresses 903, respectively, to the x-decoder901.

FIG. 10 is a timing diagram illustrating the operation of the top gatecontrol timing of the top gate handling logic circuit 905.

The timing of the top gate control is divided into two time intervals: afuse recall period, and a power ready and standby period. During thefuse recall period, the system has three sub-periods: fuse recalling;bad top gate disabling; and good top gate enabling. In the fuse recallperiod, an information row or sector is read with the top gates of thesector being set to a supply voltage VDD or a fixed bias voltage, andthe other top gates are set to zero. The power on reset (POR) sets thetop gates of bad cells also to zero. The information row is used todetermine functional or operational parameters for the productinitialization. In the bad top gate disabling sub period, the latches,which are described below, are used to disable the bad top gates by abad sector disabling procedure. The top gate voltage is set to zero forall top gates. The voltage of the top gate of the information row is setto the supply voltage VDD or a fixed bias voltage. The bad top gateshave an applied voltage of zero to disable the bad top gate using thebad sector disabling procedure. In the good top gate enabling subperiod, the good top gates are enabled. After disabling the bad topgates, the top gates of all the good cells are switched to the supplyvoltage VDD or a fixed bias voltage. The voltage on the top gates of theinformation row are set to the supply voltage VDD or a fixed biasvoltage. The voltage of the bad top gates are set to zero by a bad topgate latch. In the power ready and standby period, the bad top gates areset to zero by the bad top gate latch. The top gates of the other cellsand of the information row are set to the supply voltage VDD.

FIG. 11 is a block diagram illustrating a top gate control circuit 1100.

The top gate control circuit 1100 may be part of the x-decoder 901 (FIG.9). The top gate control circuit 1100 comprises a plurality of lowvoltage decoder circuits 1101 and a plurality of high voltage decodercircuits 1102. In one embodiment, one of the low voltage decodercircuits 1101 and one of the high voltage decoder circuits 1102 applyvoltage signals to a sector of memory cells of the memory array 904(FIG. 9) in response to decoded address signals for the sector. The lowvoltage decoder circuit 1101 applies low voltage signals to the wordlines in response to decoded address signals. The high voltage decodercircuit 1102 applies high voltage signals to the word lines, sourcelines and top gates in response to decoded address signals. In oneembodiment, the top gate control circuit 1100 comprises a low voltagedecoder circuit 1101 that includes a low voltage decoder circuit 1200(FIG. 12) and the high voltage decoder 1102 includes a high voltagedecoder 1300 (FIG. 13). In another embodiment, the top gate controlcircuit 1100 comprises a low voltage decoder 1101 that includes a lowvoltage decoder 1400 (FIG. 14) and the high voltage decoder 1102includes a high voltage decoder 1500 (FIG. 15). In yet anotherembodiment, the top gate controller circuit 1100 comprises a low voltagedecoder 1101 that includes a low voltage decoder circuit 1600 (FIG. 16)and the high voltage decoder 1102 includes a high voltage decoder 1700(FIG. 17). In yet another embodiment, the high voltage decoder 1102 mayinclude a high voltage decoder 1800 (FIG. 18). Alternatively, the lowvoltage decoder 1101 and the high voltage decoder 1102 may be combinedtogether into a mixed (low voltage and high voltage) voltage decoder.

FIG. 12 is a schematic diagram illustrating the low voltage decodercircuit 1200.

The low voltage decoder circuit 1200 applies low voltage signals to theword lines and top gate of a sector of the memory array. The low voltagedecoder circuit 1200 comprises a decoder 1201 and a decoder 1202. Thedecoder 1201 provides a select signal on the Word Lines WL0-WL7. Thedecoder 1202 provides a select signal on the top gate (TG). The decodercircuit 1200 does not include a top gate latch, which is included in thelow voltage decoder circuit 1400 (FIG. 14) and the low voltage decodercircuit 1600 (FIG. 16). The decoder circuit 1201 comprises a pluralityof control circuits 1210-1210-7, a NAND gate 1211, and an inverter 1212,and a plurality of NMOS transistors 1213, 1214 and 1215. In response toaddress signals XPA-XPD, the NAND gate 1211 and the inverter 1212 decodethe selected addresses for enabling the control circuits 1210 to applycontrol signals to selected word lines. In one embodiment, the sector ofmemory cells corresponding to the decoder circuit 1200 is controlled bysignal lines, e.g., 8 lines, of pre-decoded address signals. The controlcircuit 1210 comprises a plurality of PMOS transistors 1220, 1221 and1222, a plurality of native NMOS transistors 1223 and 1224 and a NH NMOStransistor 1225. (For simplicity and clarity, only the reference numbersof the control circuit 1210-0 are shown in FIG. 12.) The top gatecontrol circuit 1202 includes MOS transistors arranged in a simplemanner as the control circuits 1210. The top gate circuit 1202 providesselect signals on the top gate in response to the decoded address fromthe NAND decoder 1211 and provides the select signal in response to anerase signal. The low voltage decoder circuit 1200 provides low voltagesignals to a source line for a sector. The NH NMOS transistor 1213couples a source line bias (SLBIAS) to the source line in response to aprogram drive (PRGDRV-N) signal 1220. The NH NMOS transistors 1214 and1215 selectively couple the source line to ground in response to asource line power down (SLPD) signal 1221 and the decoded address fromthe NAND gate 1211.

FIG. 13 is a schematic diagram illustrating a high voltage controlcircuit 1300.

The high voltage control circuit 1300 comprises a high voltage latch1301, a plurality of PMOS transistors 1302, 1303, 1304, and 1305, anNMOS transistor 1306, a NH NMOS transistor 1307, and a source linecompensation current source 1308. The high voltage latch 1301 controlsthe application of high voltages to the word line and the source linebased on whether the top gate is defective for the sector. The highvoltage latch 1301 controls the application of the high voltage 1311 toa top gate voltage line 1312 by enabling the PMOS transistor 1305, whichoperates as a pass gate during programming. The PMOS transistor 1304controls the application of the high voltage signal 1311 to a top gatevoltage line 1312 in response to a programming high voltage signal 1313.The PMOS transistor 1304 may also act as a current limiter. The highvoltage latch 1301 also enables the PMOS transistor 1303 which providesa high voltage signal 1314 to the source line 1315 during programming.In one embodiment, the high voltage latch 1301 has a “disabled” defaultstate. The NH NMOS transistor 1307 provides a source line bias to thesource line 1315 in response to a programming driver signal 1316. ThePMOS transistor 1302 provides high voltage to the word line during eraseand may also act to limit current on the word line during erase inresponse to a high voltage enable signal 1317.

The source line compensation current source 1308 provides compensationon the source line 1315. This compensation may be to compensate for thedata pattern on the source line during programming. During a normal16-bit programming, the source line of the 16 bits are enabled but atother times a fewer number of bits, for example 2-4 bits, may beenabled. This results in a different current flow which can becompensated by the source line compensation current source 1308 whichmay replicate the 16 bits on the source line.

The high voltage latch 1301 comprises a plurality of PMOS transistors1330 and 1331, and a plurality of NH NMOS transistors 1333, 1334, 1335,and 1336 that are arranged as a latch. The high voltage latch 1301further comprises a NH NMOS transistor 1337 that operates to disable thelatch 1301 in response to a reset signal 1320. The latch 1301 furthercomprises NH NMOS transistor 1332, which is enabled by a set signal1321, and an NH NMOS transistor 1338, which is enabled by the signal onthe word line. The NH NMOS transistors 1332 and 1338 operate to enablethe latch 1301.

FIG. 14 is a schematic diagram illustrating the low voltage decodercircuit 1400.

The low voltage decoder circuit 1400 comprises a low voltage decoder1201, a latch 1401, and a top gate decoder circuit 1402. The latch 1401controls the enabling and disabling of the top gate decoder circuit 1402in the event that a top gate of one of the memory cells of the sector isdefective. In one embodiment, the default state of the top gate latch1401 is in an enable state to enable the top gate decoder circuit 1402.In a set state, the top gate latch 1401 disables the top gate decodercircuit 1402. In one embodiment the disabling is based on a bad top gateor memory cell.

The top gate latch 1401 comprises a plurality of inverters 1410 and 1411arranged as a latch, and a plurality of NMOS transistors 1412, 1413, and1414. The NMOS transistor 1412 is used to reset the state of the latchformed of the inverters 1410 and 1411 in response to a reset signal1420. The NMOS transistor 1413 together with the NMOS transistor 1416sets the latch formed of the inverters 1410 and 1411 in response to aset signal 1421. The NMOS transistor 1414 together with the NMOStransistor 1413 sets the state of the latch in response to an addressfrom the NAND gate 1211 and the inverter 1212 of the low voltage decoder1201 (FIG. 12).

The top gate decoder circuit 1402 comprises a plurality of PMOStransistors 1430, 1431, and 1432 and a plurality of NMOS transistors1433, 1434 and 1435 arranged in a similar manner as the top gate decodercircuit 1202 of the low voltage decoder circuit 1201 (FIG. 12), but thedrain of the PMOS transistor 1430 and the source of the NMOS transistor1433 are coupled to a top gate bias signal 1450 instead of an erasesignal, and the gate of the NMOS transistor 1434 is controlled by a NANDgate 1439 and an inverter 1437 in response to an erase signal and theaddress signal from the inverter 1212. The top gate control circuit 1402further comprises an inverter 1436 and a NAND gate 1438 to control theenabling of the PMOS transistors 1430 and 1431 and the NMOS transistor1433 in response to the enabling by the top gate latch 1401 and by theerase and address signal control of the NAND gate 1439. In thisembodiment, the top gate latch 1401 shares decoding with the low voltagedecoder circuit 1201 and the top gate control circuit 1402.

FIG. 15 is a schematic diagram illustrating a high voltage decodercircuit 1500.

The high voltage decoder circuit 1500 is similar to the high voltagedecoder circuit 1300 (FIG. 13), but further comprises PMOS transistors1502 and 1503 instead of a PMOS transistor 1302. The PMOS transistor1502 is controlled in a similar manner as the PMOS transistor 1302 ofthe high voltage decoder circuit 1300. The PMOS transistor 1503 mayprovide further current limiting on the word line. The PMOS transistor1502 and 1503 provide high voltage to the word line from the highvoltage supply HVEP coupled to their channel.

FIG. 16 is a schematic diagram illustrating the low voltage decodercircuit 1600.

The low voltage decoder circuit 1600 comprises a low voltage decodercircuit 1201 and a top gate decoder circuit 1602. The top gate decodercircuit 1602 may select or deselect the top gate. The top gate decodercircuit 1602 comprises a plurality of NH NMOS transistor 1610 and 1611coupled in the series between the top gate line and ground. The addressdecoder NAND 1211 and the inverter 1212 of the decoder circuit 1201enable the NH NMOS transistor 1610. An erase signal enables the NH NMOStransistor 1611.

FIG. 17 is a schematic diagram illustrating the high voltage decodercircuit 1700.

The high voltage decoder circuit 1700 is similar to the high voltagedecoder circuit 1500, but further comprises a latch circuit 1701. Thelatch circuit 1701 is similar to the latch of the low voltage circuit1400. The latch circuit 1701 comprises a latch 1301, a latch 1710, aplurality of NH NMOS transistors 1711, 1712 and 1713, an NMOS transistor1714, a plurality of PMOS transistors 1715, 1716 and 1717, a pluralityof NAND gate 1718 and 1719, and a plurality of inverters 1720, 1721, and1722. The latch 1301 is controlled by the NAND gate 1718, the inverter1720 and the NH NMOS transistor 1713 in response to a set signal 1751.The latch 1710 provides a disable signal to the NAND gate 1718 in theevent of a defective top gate to disable the top gate line. The NANDgate 1719, the inverter 1721, and the transistors 1712, 1714, 1715,1716, and 1717 control the level of the top gate line in response to thelatch 1710. In another embodiment, the supply voltage VDD may be set asa default in certain circumstances for the top gate level. The latch1710 comprises a plurality of inverters 1731 and 1732 arranged in alatch configuration. The latch 1710 further comprises a plurality ofNMOS transistors 1733, 1734, 1735 and 1736 for setting and resetting thelatch formed of the inverter 1731 and 1732. The NMOS transistor 1735resets the latch 1710 in response to a reset signal 1760. In response toa set signal 1761, the transistor 1733 sets the latch in the event thatthe transistor 1734 and 1736 are enabled by the word lines through thetransistor 1306 and a transistor 1770. In this embodiment, two wordlines are used for setting the top gate latch 1710 in the event there isa defect in one of the word lines. In another embodiment, multiple ordifferent combinations of word lines may be used such as an odd, even,or odd and even word lines.

FIG. 18 is a schematic diagram illustrating a high voltage decodercircuit 1800.

The high voltage decoder circuit 1800 uses address decoding for latchingthe top gate control. The high voltage decoder circuit 1800 comprises atop gate latch 1301, a plurality of PMOS transistors 1302, 1304, aplurality of NH NMOS transistors 1306 and 1307, and a top gate latch1801. The transistors 1302, 1304, 1305, 1306, 1307 are arranged in asimilar manner as in the high voltage decoder circuit 1300. The highvoltage decoder circuit 1800 further comprises a plurality of PMOStransistors 1804 and 1805 for latching the voltage on the top gate inresponse to the top gate latch 1801. The PMOS transistors 1802 and 1803serve to provide a medium high voltage and may act as a current limiteron the source line. The NMOS transistors 1807 and 1808 control thesetting of the latch 1301 in response to a set signal 1840. The highvoltage decoder circuit 1800 further comprises a NAND gate 1810 thatsets the top gate latch in response to address decoding signals. The topgate latch 1801 comprises a plurality of inverters 1850 and 1851arranged as a latch, an NMOS transistor 1852 for resetting the latch, anNOR gate 1853, an output inverter 1854 and an NMOS transistor 1855. TheNMOS transistor 1855 sets the state of the top gate latch in response tothe NOR of the output of the NAND gate 1810 and a set signal that areset by the NOR gate 1853.

FIG. 19A is a flowchart illustrating the programming operation for thetop gate memory cell.

First the top gate and word line of the selected memory cells areverified to be good or bad (block 1901). If they are good, then aprogramming operation may start (block 1905). If either one is bad, thenthe availability of a replacement redundant TG,WL is sought (block1903). If it is, then the programming may start (block 1905). If it isnot, then the operation stops and a bad flag is set (block 1913). Afterprogramming starts (block 1905), the cell is verified (block 1907) by,for example, comparing the data output, voltage output or current outputto the data input, voltage input, or current input, respectively. If theverify is correct, the flag is set that the cell is good (block 1915).On the other hand, if the cell read is not verified, a programming stepis done (block 1909). During the programming step, various programmingoperations may be done. The voltage of the top gate may be setincrementally (V-TG=V-TG0+dVTG) in combination with fixed or incrementalV-SL, I-BL, V-WL, or Time or the source line voltage is incremented(V-SL=V-SL0+dVSL) in combination with fixed or incremental V-TG, I-BL,V-WL, or Time or the bit line current is set (I-BL=I-BL0+dIBL) incombination with fixed or incremental V-TG, V-SL, V-WL, or Time or thetime incremented (Time=Time0+dTime) in combination with fixed orincremental V-TG,V-SL, I-BL, or V-WL. The count may be incremented. Ifthe maximum count is not reached (block 1911), the verify is repeated(block 1907). On the other hand, if the verify count has been reached,then the cell is bad (block 1913) and the operation stops.

FIG. 19B is a waveform illustrating the operation of the top gatehandling logic circuit of FIG. 9.

FIG. 19B shows an operational waveform for the top gate cell inprogramming. First all unselected bitlines and selected bitlines arepulled up to a bias voltage VBLINH to inhibit programming. At the sametime or slightly after selected SL is pulled up to a bias voltage suchas VBLINH. At the same time or slightly after selected WL is pulled upto a bias programming wordline voltage VWLP. Then selected SL is pulledup to a bias source line programming voltage VSLP. At the same time orslightly after selected TG is pulled up to a top gate programmingvoltage VTGP. At this time, the selected bitline is released from theprevious bias VBLINH. A programming current applied to either earlier orapplied at this time then pulls down the bitline to a stable biasvoltage VBLP. The cell now sees complete programming condition at itsterminal, VBLP, VWLP, VTGP. At the end of programming, to avoid possibledisturb VTGP ramps down first, then VWLP ramps down. At the same time orslightly after VSLP ramps down. Finally all bitlines ramps down. Thiscompletes a programming cycle

The system includes top gate capacitance loading and coupling handling.The metal may be arranged to minimize coupling effect between top gatelines by, for example, including shielding. In another embodiment, thetop gates may be coupled using dynamic or pseudo-dynamic coupling.

FIG. 20 is a schematic diagram illustrating dynamic top gate coupling ina first embodiment.

A word line 2001 includes resistance represented by resistors 2002 andcapacitance represented by capacitors 2003. A top gate line 2011includes resistance represented by resistors 2012 and capacitancerepresented by capacitors 2013. The top gate line 2002 and the word line2001 are controlled by enable transistors 2005 and 2015 and through aninverter 2006 and 2016. The word line 2001 and the top gate line 2011are coupled together by a capacitance 2033. As the word line voltageincreases, the coupling causes the top gate voltage to increase.

FIG. 21 is a schematic diagram illustrating dynamic top gate coupling ina second embodiment.

A word line 2101 includes resistance represented by resistors 2102 andcapacitance represented by capacitors 2103. A top gate line 2111includes resistance represented by resistors 2112 and capacitancerepresented by capacitors 2113. The top gate line 2102 and the word line2101 are controlled by enable transistors 2105 and 2115 and through aninverter 2106 and 2116. The word line 2101 and the top gate line 2111are coupled together by a capacitance 2133. In this embodiment, thetransistor 2115 is turned off after the top gate reaches a bias level sothat the top gate line 2102 floats. In this the dynamic coupling causesthe top gate to follow the word line. As the word line voltage increasesor decreases, the coupling causes the top gate voltage to follow theword line voltage simultaneously.

In another embodiment, the driver of the top gate line may also be aweak driver to provide small bias which will provide similar couplingcharacteristics. In yet another embodiment, a dummy word line can beswitched from one to zero for sector to cancel the word line (switchedfrom zero to one) and gate line coupling but at the expense ofadditional area.

In the above description, the (top gate) latch is used to enable ordisable the top gate. The latch may be also be used for word line orsource line handling in a similar manner.

In the foregoing description, the top gate latch is used to disable thebad top gate. In another embodiment, the top gate latch is used todisable the program or erase of any top gate by disabling the highvoltage latch. The top gate latch can also be used to disable the readof any memory cells by disabling the low voltage decoder side ordisabling the top gate in read. The set or reset of the top gate latchin this case can be done by a power up recall, a command, or an internalcontrol algorithm. The top gate latch can be used as a lock/unlock bitcontrol for program, erase, or read

In the foregoing description, various methods and apparatus, andspecific embodiments are described. However, it should be obvious to oneconversant in the art, various alternatives, modifications, and changesmay be possible without departing from the spirit and the scope of theinvention which is defined by the metes and bounds of the appendedclaims.

1.-4. (canceled)
 5. A memory system comprising: a plurality of memorycells arranged in sectors, top gates of memory cells in a sector beingcoupled to a first line, source lines of memory cells in a sector beingcoupled to a second line.
 6. The memory system of claim 5 wherein thememory cells are multilevel memory cells.
 7. The memory system of claim5 wherein the memory cells are tip erased memory cells.
 8. The memorysystem of claim 5 wherein the memory cells are source side injectionmemory cells.
 9. The memory system of claim 8, wherein each memory cellfurther comprising: a floating gate, a select gate, wherein saidfloating gate having a tip adjacent to said select gate for erasing saidfloating gate through said tip to said select gate.
 10. The memorysystem of claim 8, wherein each memory cell further comprising: afloating gate, wherein said floating gate having a tip adjacent to saidtop gate for erasing said floating gate through said tip to said topgate.
 11. A memory system comprising: a plurality of memory cellsarranged in sectors, source lines of memory cells in a sector beingcoupled to a first line and top gate lines of memory cells in saidsector being coupled to individual lines.
 12. The memory system of claim11 wherein the memory cells are multilevel memory cells.
 13. The memorysystem of claim 11 further comprising: a plurality of word lines coupledto at least one other individual line.
 14. The memory system of claim 11wherein the memory cells are tip erased memory cells.
 15. The memorysystem of claim 11 wherein the memory cells are source side injectionmemory cells.
 16. A memory system comprising: a plurality of memorycells arranged in sectors, the top gates of a first group of memorycells in a sector being coupled to a first line, source lines of asecond group of memory cells in a sector being coupled to a second line,the top gates of a third group of memory cells in a sector being coupledto a third line, source lines of a fourth group of memory cells in asector being coupled to a fourth line, the first group including memorycells in the second and fourth groups, the third group including memorycells in the second and fourth groups, but not in the first group. 17.The memory system of claim 16 wherein the memory cells are multilevelmemory cells. 18-31. (canceled)
 32. The memory system of claim 44further comprising a first weak driver for driving the word line, and asecond weak driver for driving the top gate line.
 33. The memory systemof claim 44 wherein the top gate line is floating. 34-43. (canceled) 44.A memory system comprising: a plurality of memory cells arranged insectors, each memory cell having a top gate; and control circuitrycoupled to the plurality of memory cells, wherein the control circuitryis configured to program top gates in the plurality of memory cells. 45.The memory system of claim 44 wherein the control circuitry includes atop gate handling logic circuit.
 46. The memory system of claim 44wherein the control circuitry is configured to: pull up all bitlines toa first bias voltage; pull up a selected source line to the first biasvoltage; pull up a selected word line to a bias programming wordlinevoltage; pull up the selected source line to a bias source lineprogramming voltage; pull up a selected top gate to a top gateprogramming voltage; release the selected bitline from the first biasvoltage; and pull down the selected bitline to a stable bias voltage viaapplication of a programming current, wherein the top gate cell hascomplete programming conditions at its terminal.
 47. The memory systemof claim 46 wherein the control circuitry, at the end of programming, isfurther configured to: ramp down the top gate voltage; ramp down theword line voltage; ramp down the source line voltage; and ramp down thevoltages on all of the bitlines.
 48. The memory system of claim 44wherein the memory cells are tip erased memory cells.
 49. The memorysystem of claim 44 wherein the memory cells are source side injectionmemory cells.
 50. The memory system of claim 44 wherein the memory cellsare multilevel memory cells.
 51. The memory system of claim 44 furthercomprising circuitry configured to provide top gate capacitance loadingand/or coupling handling.
 52. The memory system of claim 44 wherein thetop gates are coupled using dynamic coupling and/or pseudo-dynamiccoupling.
 53. The memory system of claim 5 wherein the top gate line isdynamically coupled to the word line.
 54. The memory system of claim 11wherein the top gate line is dynamically coupled to the word line. 55.The memory system of claim 16 wherein the top gate line is dynamicallycoupled to the word line.
 56. The memory system of claim 44 wherein thetop gate line is dynamically coupled to the word line.
 57. The memorysystem of claim 5 wherein the top gate line is floating.
 58. The memorysystem of claim 11 wherein the top gate line is floating.
 59. The memorysystem of claim 16 wherein the top gate line is floating.